Megasonic wafer cleaning system uses higher frequency ultrasonic energy in mega hertz scale to boost removal of submicron particles from substrates and chemical reactions. Compared to low frequency ultrasonic cavitations, megasonic cavitations effect can give smaller particles removal as well as less damage on the substrates.

Batch type  megasonic wafer cleaning system uses large megasonic transducer which can emit sound field with large area, then it can provide high cleaning efficiency. However, the distribution of sound field in the tank is not uniform. The intensity where is further way from the megasonic transducer is usually lower. And the transfer efficiency of sound power is low. Shower type megasonic wafer cleaning system can directly focus the megasonic energy onto the substrate surface, consequently the sound field can distribute uniformly on the substrate surface by moving the substrate and megasonic wafer cleaning system. However, the flow rate of cleaning fluid required by shower type megasonic wafer cleaning system is quite high. Therefore it wastes cleaning fluid too much.  

Cover type megasonic wafer cleaning system is an optimized meagsonic wafter cleaning technology which has the advantages of both batch type and shower type  megasonic wafer cleaning system and removes the drawbacks of both types. It can directly transfer the megasonic energy with large area onto the substrate surface, has quite high uniformity of sound field as well as the transfer efficiency. Furthermore, cover type  megasonic wafer cleaning system gives very high utilization of cleaning fluid.      

The benefits of Siansonic cover type megasonic wafer cleaning system:

• Directly cover on the surface of the object to be cleaned with a small gap, providing higher energy conversion efficiency

• Greatly reduce the use of cleaning fluid

• Extremely low ultrasonic cavitation effect, no damage to device surface

• No secondary pollution of cleaning fluid

• Ultra-high cleaning precision, which can remove 0.2 micron particles on the object surface

• Made of non-metallic high anti-corrosion materials, suitable for various acid-base and organic solvents

• Quartz or sapphire matching layer technology, no risk of impurities falling off the device

• Unique transducer bonding technology provides higher stability and durability

• Megasonic generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive