Shower Type Megasonic Cleaning Nozzle

  • Single point shower type megasonic cleaning nozzle, no secondary pollution

  • Ultra-high frequency ultrasound, up to 3MHz

  • High cleaning precision megasonic cleaning system, ability to remove particles in 0.2 micron

  • Ultra-low cavitation effect, no damage to device surface for megasonic wafer cleaning

  • Megasonic cleaning system with no metal materials contact with liquid, no risk of conductive substances falling off

  • High corrosion resistance, workable with various acid and alkali solutions and organic solvents

shower type megasonic nozzle wafer cleaning megasonic cleaning system

Megasonic cleaning uses higher frequency ultrasonic energy in mega hertz scale to boost removal of submicron particles from substrates and chemical reactions. Compared to low frequency ultrasonic cavitations, megasonic cavitations effect can give smaller particles removal as well as less damage on the substrates.

Shower type megasonic cleaning system integrates the megasonic transducer into the nozzle. The megasonic cleaning nozzle sprays the fluid with megasonic energy onto the surface of substrates such as wafers to accomplish the cleaning process. The advantage of shower type megasonic cleaning is that it can directly make the point to point process on the substrate surface. The megasonic focus point can be directly put onto the wafer surface and then it realizes the entire surface process by moving the wafer and megasonic cleaning nozzle. Compare to batch type megasonic cleaning system, the transfer efficiency of megasonic power on shower type is higher. The issue on batch type megasonic cleaning that the sound field changes as liquid depth changes in the tank can be avoided. The shower type megasonic cleaning nozzle is able to provide more uniform sound field on the surface of substrate. In addition, the shower type megasonic cleaning doesn’t have the second pollution due to particles cleaned away from the substrates in the cleaning fluid in the tank.  

The benefits of Siansonic shower type megasonic cleaning nozzle:

  • Single point spray megasonic cleaning, compared with traditional tank cleaning, can solve the problem of secondary pollution of cleaning solution.

  • Extremely low ultrasonic cavitation effect, no damage to device surface, suitable for megasonic wafer cleaning

  • Ultra-high megasonic cleaning precision, which can remove dirt particles in 0.2 micron on the object surface

  • Made of non-metallic high anti-corrosion materials, suitable for various acid-base and organic solvents

  • Quartz or sapphire coupling layer technology, no risk of impurities falling off the device

  • Unique transducer bonding technology gives higher stability and durability

  • Megasonic cleaning generator using the third-generation semiconductor technology, fully realizing digital high-frequency and high-power drive

  • Megasonic cleaning frequency: 1MHz, 2MHz, 3MHz

  • Housing material: PEEK, PCTFE

  • Ultrasonic sensor: monitor the cleaning liquid in the tubing to prevent the nozzle from dry burning

  • Liquid feeding pump

  • Wafer cleaning

  • Mask Cleaning

  • CMP (chemical mechanical polishing)

  • Development

  • Etching

  • Photoresist stripping

  • Lift-off

  • Lens cleaning

  • Precision cleaning of display screen and other microelectronic industries

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+86 1081502688


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